Taipei, Taiwan – September 7th, 2010) Lanner Electronics, Inc. is cooperating with Wallflower Global Ltd. to deliver complete digital signage solutions. Lanner is a specialist hardware manufacturer known for making rugged, small form factor IPCs for both industrial and commercial uses. Wallflower has given the stamp of approval to Lanner’s top-of-the-line digital signage platform the LEC-7900. The LEC-7900 is Lanner’s most popular digital signage appliance and is capable of running 3 streams of video.
Wallflower Global has tested Lanner’s LEC-7900 and has approved the platform for safe use with their software. This means when customers purchase the LEC-7900, they are guaranteed compatible software with their digital signage platform. The LEC-7900 is Lanner’s most popular signage platform, utilizing the Nvidia MCP7A chipset with Intel Core 2 Duo processing power. It features HDMI, DVI-D and 2 VGA video ports for flexibility in deployment. Other communication ports include 4 x USB 2.0, dual RJ-45 GbE LAN ports, Stereo Line Out and 2 RS-232 COM ports. The LEC-7900 has gone through extensive shock, vibration and temperature tests. It can safely operate between -10o and 50o Celsius. The LEC-7900 is available for sample orders immediately. For more information or to request a sample, contact a Lanner representative at sales@lannerinc.com, or visit us on the web at: http://www.lannerinc.com/wallflower/LEC-7900 About Lanner Founded in 1986 and publicly listed (TAIEX 6245) since 2003, Lanner Electronics, Inc. is an ISO 9001 certified designer and manufacturer of network application platforms, network video platforms and applied computing hardware for first-tier companies. Lanner’s expertise also extends to include driver and firmware support, enabling customers to optimize hardware and software communication to achieve faster time to market. With headquarters in Taipei, Taiwan and branches in the U.S. and China, Lanner is uniquely positioned to deliver custom technical solutions with localized, value-added service. Lanner is an Associate Member of the Intel® Embedded and Communications Alliance, a group of companies committed to developing modular, standards-based solutions based on technologies, processors, products, and services from Intel®.
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